Thursday 12 March 2020 | British Motor Museum | Gaydon

Practical CPD Accredited Workshops

To ensure you get the most out out of your visit, we offer a FREE TO ATTEND programme of CPD accredited workshops.

(Please bookmark this page as we are adding more content regularly)

Book early - first come, first served!

9:30 AM - 10:10 AM - PCB

Manage SI/PI, DFM, DFA and DFT in the design cycle to prevent costly re-spins

Room: Lecture Room 1

Andrew Windscheffel, EMEA AE Director, Cadence Design Systems

PCB layout tends to suffer the same design cycle – which is layout the PCB without enough rules to check the full fabrication, assembly and SI/PI performance. This leads to costly re-spins – costly in time to market and the financial cost of a physical PCB that does not perform well. Improving the way we design by understanding SI/PI needs, fabrications needs and rules, assembly needs, and how we can turn those needs into real time Design Rules which can help to cut out costly re-spins, which then improves time to market and removes costly re-spins of the PCB.


1. Rule based design leads to a better final products
2. Different PCB design rules for better design processes
3. Different design rules for different design issues should be used
4. Understanding the supply chain needs and methodologies
5. Investing in tools is cheaper than costly re-spins

9:30 AM - 10:10 AM - Materials

Plasma and Corona – What Will You Do With Plasma?

Room: Lecture Room 2

Chris Howey, managing director, Tantec

Plasma and corona systems have been used for decades – the traditional use is to ‘make things stick’, inks, glues, coatings or other liquids bonding to a solid.

But what if you’re process already works? A big area for treatment is removing solvent based processes and replacing them with water based alternatives, or replacing older expensive polymers for newer tough to bond polymers.

There’s also a big trend of using the technology to assist with cleaning and degreasing, removing manual abrading or primers and removing operator dependent processes to gain higher repeatability.


1. What are corona and plasma treatments
2. Traditional uses for corona and plasma
3. Reasons to consider using the equipment
4. How plasma and corona can help solve the problem of solvent reduction
5. Newer and future uses for plasma and corona

9:30 AM - 10:10 AM - Fastening & Joining

Achieve your productivity potential with UV light curing adhesives

Room: Lecture Room 3

Peter Swanson, managing director, INTERTRONICS

Manufacturing in the UK is strong, but productivity remains a concern. Adhesives, coatings and protective materials which cure with light can offer significant process as well as functional improvements to an assembly. This seminar will present an overview of the technology, including how it works and example applications. lt will then focus on advances which can help improve productivity, both in light curable chemistry and the curing equipment, backed up by case studies.

1. How light curing works
2. Typical applications
3. New capabilities of the chemistry
4. Equipment developments, including LED based curing
5. Case studies showing productivity gains

10:30 AM - 11:10 AM - PCB

Why thermal simulation is a must for electronics design?

Room: Lecture Room 1

Matt Evans, product engineer, 6SigmaET by Future Facilities

There are so many things to consider when designing a PCB, from signal integrity to Design for manufacture. Thermal management can often get forgotten about and left to the last minute.

In this workshop you will learn how to use thermal simulation to identify thermal issues early in the design process. You will discover how to import PCB designs from your EDA software in to a 6SigmaET thermal simulation, how to accurately model components on your board and how to use simulation results to improve a systems thermal management. Using simulation helps you eliminate thermal issues and streamline your design process. 


1.            How thermal simulation help identify and resolve thermal issues in electronics
2.            How to create thermal simulation from concept to final design
3.            How heat transfer through a PCB
4.            How to Import PCB designs from your EDA software into a 6SigmaET thermal simulation
5.            How to accurately model electronic components in a thermal simulation

10:30 AM - 11:10 AM - Materials

Solving the challenges of inline automated surface defect detection

Room: Lecture Room 2

Jason Biddulph, applications & integration engineer, Micro-Epsilon UK

With the ever increasing demand on quality improvements, surface inspection systems can be used to identify both aesthetic defects and potential functional and integrity defects.

The challenge for inspection systems is to allow for the natural deviation in form to be inspected and still achieve the levels of resolution required to identify those localised surface defects. With high precision measurement hardware and patented artificially intelligent algorithms Micro-Epsilon have utilised their years of experience and unique know how to combat these common real life challenges faced by today’s industry.


1. Why there is an increased demand for surface inspection
2. Why conventional CAD comparison vision based systems are not suitable for surface inspection
3. How AI algorithms simulate conventional destructive testing methods without damaging parts
4. Typical defects that create problems in production environments
5. How 3D vision is replacing human auditors

11:30 AM - 12:10 PM - Materials

Aluminium with form- Hot Form Quench lightweighting for new vehicle architectures

Room: Lecture Room 2

Bruce Girvan, director IP and licensing, Impression Technologies

Impression Technologies has been instrumental in developing HFQ® Technology, which is revolutionising the exploitation of aluminium. We provide the knowledge and expertise to support HFQ® technology, empowering you to transform your project according to your engineering needs, from concept to production. HFQ® Technology is a hot forming production method for stamping complex-shaped aluminium components from high and ultra-high strength alloys. HFQ® enables extremely complex aluminium parts to be formed in a single press operation, whilst achieving high levels of strength in the finished part using standard grades of aluminium.

1. Aluminium is even more extraordinary than you thought- it can make high strength pressed parts
2. HFQ- what is it and how it provides greater freedom for designers
3. HFQ provides OEMs with what they need for the challenges ahead
4. HFQ can unlock even more recyclability for aluminium
5. HFQ is available for high volume manufacture

12:30 PM - 1:10 PM - PCB

How to maximise PCB space with connector selection

Room: Lecture Room 1

Neil Moore, product manager – EMC Boardware & Industrial Connectors, Harwin

Connectors are often the last components considered during PCB design, yet they account for a considerable amount of PCB space and a large percentage of the overall B.O.M. value. When specified in the right way, the resulting saving in PCB space can be significant.

We will investigate the common connector selection mistakes and how they can be avoided, as well as providing practical tips on selecting the right connector for the job.


1. Common connector selection mistakes and their implications
2. The advantages of correct connector selection
3. How to specify with success
4. A connector specifier’s checklist

12:30 PM - 1:10 PM - Materials

Aluminium Matrix Composites: Displacing Titanium Landing Gear Components

Room: Lecture Room 2

Richard Thompson, commercial director, Alvant

An introduction to Aluminium Matrix Composites and their application in aerospace landing gear systems.

1. What are Aluminium Matrix Composites
2. How do Alvant make Aluminium Matrix Composites
3. How do Aluminium Matrix Composites compare against other materials
4. What are the benefits on a particular landing gear component

>> Click here to register for your FREE ticket!