IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between RF design and manufacturing layout design platforms. Overcoming cross-platform interoperability issues shortens turnaround times and eliminates potential design errors. This presentation will demonstrate using RF application examples the ways in which the design platforms by Cadence® supports effective RF-to-PCB workflow.
5 key learning points in this session:
1. RF design considerations and the importance of layout
2. EDA software capability
3. Reducing mistakes made in RF IP design exchange
4. Cutting edge tool integration
5. Thermal simulation consideration.